address:201, Factory 6, Longhui Industrial Park, Fuqiao 3rd District, Xinhe Community, Fuhai Street, Baoan District, Shenzhen china
General assembly capabilities
BGA, micro-BGA, QFN, CSP and any leadless devices up to .35mm pitch assembly with 100% 3D X-ray inspection
PCB components, including all types of BGAs, QFNs, CSPs, 0201, 01005, 08004, POP, and press fit components in small quantities
DFA process identifies almost all manufacturing issues before actual assembly saving production holdups
RoHS, leaded, indium, clean & no clean chemistries
Paste in-hole
De-ionized water cleaning of assembled boards